Type

Printing line

Line products Solder mask products Laser drilling machine

Pan-semiconductor

Direct Imaging lithography Projection lithography AOI detection

Screen printing

CTS Series

Photovoltaic cells

Core components

DLP optical machine (optical engine) UV-LD/LED light source High-precision optical lens High-precision optical system customization

Maximum substrate size：610mm×630mm (24"× 24")

Analyze：4μm/4μm

Alignment accuracy：±2μm

Capacity：<42s/pcs @ 610mmx630mm

& 100mj/cm²& Each four-point counterpoint X defense

Wafer size：100/150/200/300mmWafer（selectable）

Analyze：2μm L/S

Depth of focus：20μm

Front engraving accuracy：0.5μm

Capacity:40WPH@12inch

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