Type

Printing line

Line products Solder mask products Laser drilling machine

Pan-semiconductor

Direct Imaging lithography Projection lithography AOI detection

Screen printing

CTS Series

Photovoltaic cells

Core components

DLP optical machine (optical engine) UV-LD/LED light source High-precision optical lens High-precision optical system customization

Maximum mesh frame: 2000×1500mm

Process analysis (L/S): 40/40µm

Exposure mesh frame thickness: 20mm-40mm

Exposure photosensitive adhesive thickness: 2-130μm (including screen thickness)

Capaion capacity:

85s-110s/side

@900mm×900mm

& 30mj/cm²

Maximum mesh frame: 1300×1200mm

Process analysis (L/S): 40/40µm

Exposure mesh frame thickness: 20mm-40mm

Exposure photosensitive adhesive thickness: 2-130μm (silk thickness)

Capaion capacity:

75s-100s/side

@900mm×900mm

& 30mj/cm²

Maximum mesh frame: 1200×1000mm

Process analysis (L/S): 40/40µm

Exposure mesh frame thickness: 20mm-40mm

Exposure photosensitive adhesive thickness: 2-130μm (including screen thickness)

Capaion capacity:

135s-180s/side

@900mm×900mm

& 30mj/cm²

help We are ready to help you.
Contact the account manager
Get expert advice quickly, and we will meet your needs in an all-round way.