Suitable product: 210mm*105mm (210 half piece)

The thinnest/thickest plate surface: 100μm ~180μm

The width of the groove after development: 15um (i.e. copper grid width)

Capaion capacity: ≥7200 tablets/H (based on 210 half tablets)

Process route: battery front and back ink printing/drying/exposure/dification/edge wrapping (secondary graphics), loading and unloading are automated, compatible with AGV docking

Maximum substrate: 210×105mm

Mass production analysis (L/S): 15/15µm

To-position accuracy: edge-finding-to-position

Capacapacity: 0.5s/pcs &70mj/cm²&210mm×105mm

Wire: 7200 pieces/h

Maximum substrate: 220×220mm

Process analysis (L/S): 8/8µm

to-point accuracy: edge-finding to-to-bit/Mark point-to-to-bit

Capaion capacity: 500pcs/h &70mj/cm2 (210mm×105mm)

Maximum substrate: 220×220mm

Process analysis (L/S): 3/3µm

to-point method: edge-to-bit/Mark point-to-bit

Capaion capacity: 45pcs/h &70mj/cm2 (210mm×105mm)