DSS-08

Product advantages

support compatible with different sizes of battery cell alignment exposure
such as: 158/166/182/210 whole piece and half piece

Product advantages

laser direct writing method
exposure imaging of the grid line of photovoltaic cells
Important support for copper plating process

Product advantages

compatible with manual and automatic online and offline materials
upgradeable configuration to increase production capacity

Product advantages

support Mark positioning and edge-finding positioning

EQUIPMENT PARAMETERS
Product features single machine fully automatic, split exposure, high production capacity
Maximum substrate size 220mmx220mm
Compatible substrate size 156mmx156mm (including half piece)
Substrate thickness 0mm-lmm
Mass production analysis (L/S) 8µm/8µm
Line width accuracy ±10%
Depth of field ±50µm
Allocation accuracy edge-finding opposition ±40µm, Mark point opposition ±8µm
Production efficiency 500pcs/h&70mj/cm² (210mmx105mm)
设备参数

产品特色

单机全自动,分割曝光,产能高

最大基板尺寸

220mm×220mm

最小基板尺寸

156mm×156mm(含半片)

基板厚度

0mm~1mm

量产解析(L/S)

8μm/8μm

线宽精度

±10%

景深

±50μm

对位精准度

寻边对位±40μm,Mark点对位±8μm

生产效率

500pcs/h &70mj/cm2(210×105mm)