Product advantage
High resolution 2μm/2μm（L/S）
Product advantage
Die level Distortion and focal surface
Real-time compensation
Product advantage
Engraving accuracy 0.5µm
Product advantage
The living layout design has no mask size limit
| Wafer size | 100/150/200/300mmWafer（selectable） |
| Analyze | 2μm L/S |
| Linewidth accuracy | ±10% |
| Depth of focus | 20μm |
| Front engraving accuracy | 1μm |
| Imaging material | photoresist（PR） |
| Light source spectrum | 405±5nm |
| capacity | 40WPH@12inch |
| Exposure energy | 20-1000mj/cm² or higher |
| Total power of light source | 6W |
| Data entry | GDSII, Gerber274X, ODB++ |
| Applicable technology | Frontal exposure、The right side Alignment |
| Single power supply | AC380V-50HZ-8KW（Primary equipment） |
| Weight per unit | 2000kg |
| Overall dimension（L×W×H） | 1810mmL×1700mmW×2105mmH |
| Temperature/humidity | 22℃±1℃， 40%-60%（non-condensation） |
| OverlayCompensation | fixed Overlay、Auto Overlay |
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