Product advantage
High yield.
Product advantage
High reliability.
Product advantage
Modular design.
Product advantage
Suitable for packaging
MicroLED
MEMS and other processes
| Wafer Size | 200mm Wafer(300mm selectable) |
| Wafer thickness | 0.1mm～5mm |
| Resolution | 2μm L/S |
| Linewidth accuracy | ±10% |
| Depth of focus | 20μm |
| Front engraving accuracy | 0.5μm |
| Capacity | 150WPH |
| Imaging material | photoresist（PR） |
| Light source spectrum | 365nm |
| Exposure energy | 20-1000mj/cm² or higher |
| Reticle | 9 inch |
| Applicable process | positive exposure, positive Alignment |
| Single power supply | AC380V-50HZ（Primary equipment） |
| Weight per unit | 6500kg |
| Overall dimension（L×W×H） | Host machine：3100mmL×1750mmW×2750mmH Accessory equipment：1300mmL×880mmW×1,650mmH |
| Temperature/humidity | 22℃±1℃，30%-55% |
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