Product advantages
assembly line design
Product advantages
assembly line design
Product advantages
large board dual-machine dual-table connection anti-welding DI solution
Product advantages
at the same time provide conventional models
Product features | matching one-to-four version (43'×24.5') |
Maximum substrate size | 1100mm×630mm (effective exposure size 1100mm×623mm) |
Minimum substrate size | 400mm x 400mm (single machine), 500mm×710mm (automatic line) |
Substrate thickness | 0.1mm~5mm (single machine), 0.1mm~3.5mm (wired) |
Process analysis (bridge/window) | 45μm/65μm |
Line width uniformity | ±10% |
Depth of field | ±300μm |
DMD splicing | ≤3μm |
Outer alignment accuracy | ±15μm |
Energy uniformity | ≥95% |
Undercut | When the ink thickness is 25μm, the undercut value is less than 15μm |
Ink color | varisity |
Exposure time (four-point opposite position, excluding upper and lower plates) | 12 seconds/face @1100mm×623mm&500mj/cm² |
Production efficiency (four-point facing) | 5 pieces/minute @1100mm×623mm&500mj/cm² |
Number of stand-alone countertops | upper and lower interactive double countertops |
Weight of stand-alone equipment | 5500kg |
Stand-alone dimensions | 2870mm×2200mm×1770mm |
Automatic line size | 6600mm×3800mm×2050mm (excluding plate receiving and dissipation machine) |
Working height (transmission height) | 1030±20mm |