Product advantages
assembly line design
Product advantages
assembly line design
Product advantages
large board dual-machine dual-table connection anti-welding DI solution
Product advantages
at the same time provide conventional models
Product features | large board extreme production capacity |
Maximum substrate size | 1260mm×730mm (effective exposure size 1245mm×724mm) |
Minimum substrate size | 400mm x 400mm (single machine), 500mm×710mm (automatic line) |
Substrate thickness | 0.1mm~5mm (single machine), 0.1mm~3.5mm (wired) |
Process analysis (bridge/window opening) | 50μm/75μm |
Line width uniformity | ±10% |
Depth of field | ±300μm |
DMD splicing | ≤3μm |
Outer alignment accuracy | ±15μm |
Energy uniformity | ≥95% |
Undercut | When the ink thickness is 25μm, the undercut value is less than 15μm |
Ink color | varisity |
Exposure time (four-point to position, excluding upper and lower boards) | 10 seconds/face @1245mm×680mm&500mj/cm² |
Production efficiency (four-point position) | 6 pieces/minute @1245mm×680mm&500mj/cm² |
Number of stand-alone countertops | front and rear interactive double countertops |
Weight of stand-alone equipment | 7500kg |
Stand-alone size | 3910mm×1845mm×2050mm |
Automatic wire dimensions | 16500mm×3950mm×2050mm |
Working height (transmission height) | 960±10mm |