DPM-75T Twin

Product advantages

assembly line design

Product advantages

large board dual-machine dual-table connection anti-welding DI solution

Product advantages

at the same time provide conventional models

EQUIPMENT PARAMETERS
Product features large board extreme production capacity
Maximum substrate size 1260mm×730mm (effective exposure size 1245mm×724mm)
Minimum substrate size 400mm x 400mm (single machine), 500mm×710mm (automatic line)
Substrate thickness 0.1mm~5mm (single machine), 0.1mm~3.5mm (wired)
Process analysis (bridge/window opening) 50μm/75μm
Line width uniformity ±10%
Depth of field ±300μm
DMD splicing ≤3μm
Outer alignment accuracy ±15μm
Energy uniformity ≥95%
Undercut When the ink thickness is 25μm, the undercut value is less than 15μm
Ink color varisity
Exposure time (four-point to position, excluding upper and lower boards) 10 seconds/face @1245mm×680mm&500mj/cm²
Production efficiency (four-point position) 6 pieces/minute @1245mm×680mm&500mj/cm²
Number of stand-alone countertops front and rear interactive double countertops
Weight of stand-alone equipment 7500kg
Stand-alone size 3910mm×1845mm×2050mm
Automatic wire dimensions 16500mm×3950mm×2050mm
Working height (transmission height) 960±10mm
设备参数

产品特色

大板极限产能

最大基板尺寸

1260mm×730mm(有效曝光尺寸1245mm×724mm)

最小基板尺寸

400mm×400mm(单机),500mm×710mm(自动线)

基板厚度

0.1mm~5mm(单机),0.1mm~3.5mm(连线)

工艺解析(桥/开窗)

50μm/75μm

线宽均匀性

±10%

景深

±300μm

DMD拼接

≤3μm

外层对位准精度

±15μm

能量均匀性

≥95%

Undercut

油墨厚度25μm时,undercut值小于15μm

油墨颜色

杂色

曝光时间(四点对位,不含上下板)

10秒/面@1245mm×680mm&500mj/cm2

生产效率(四点对位)

6片/分钟@1245mm×680mm&500mj/cm2

单机台面数量

前后交互双台面

单机设备重量

7500kg

单机外形尺寸

3910mm×1845mm×2050mm

自动线外形尺寸

16500mm×3950mm×2050mm(不含收放板机)

工作高度(输送高度)

960±10mm