DPS-25V

Product advantages

MLB large plate line pioneer
mature large board DI experience helps
improve the utilization rate of large plate
reduce costs and increase efficiency

Product advantages

horizontal and vertical layout for selection
flexible matching production workshop
large and small boards compatible with automation

Product advantages

large panel analysis increased to 25µm
to meet the needs of high-density products

EQUIPMENT PARAMETERS
Product features large board high resolution
Maximum substrate size 1260mm×730mm (effective exposure size 1245mm×724mm)
Minimum substrate size 400mm×400mm (single machine), 500mm×710mm (automatic line)
Substrate thickness 0.1mm~5mm (single machine), 0.2mm~4.0mm (automatic line)
Process analysis (L/S) 25μm/25μm
Line width accuracy ±10%
Depth of field ±300μm
Interlayer accuracy 30μm
Outer alignment accuracy ±15μm
Exposure time (50mj & four-point opposition, excluding upper and lower plates) 8.3 seconds/face @1245mm×723mm (49"×28.5")
Production efficiency (50mj & four-point pair) 6 pieces/minute @ 1245mm× 723mm (49"×28.5")
Light source power 24W (optional 48W)
Number of single-machine countertops single countertops
Inner circuit module common to the inner and outer layers
Weight of stand-alone equipment 5500kg
Stand-alone size 3658mm×1700mm×2050mm
Automatic line size 6600mm×3800mm×2050mm (excluding plate receiving and dissipation machine)
Working height (transmission height) 950±20mm
设备参数

产品特色

大板高解析

最大基板尺寸

1260mm×730mm(有效曝光尺寸1245mm×724mm)

最小基板尺寸

400mm×400mm(单机),500mm×710mm(自动线)

基板厚度

0.1mm~5mm(单机),0.2mm~4.0mm(自动线)

工艺解析(L/S)

25μm/25μm

线宽精度

±10%

景深

±300μm

层间对位精准度

30μm

外层对位准精度

±15μm

曝光时间(50mj&四点对位,不含上下板)

8.3秒/面@1245mm×723mm(49"x28.5")

生产效率(50mj&四点对位)

6片/分钟@1245mm×723mm(49"x28.5")

光源功率

24W(可选48W)

单机台面数量

单台面

内层线路模组

内外层通用

单机设备重量

5500kg

单机外形尺寸

3658mm×1700mm×2050mm

自动线外形尺寸

6600mm×3800mm×2050mm(不含收、放板机)

工作高度(输送高度)

950±20mm