Product advantages
truly market-proven mass-produced anti-welding
DI products
Product advantages
compared with traditional exposure machines
Product advantages
models are suitable for different customers to choose
| Product features | capacity upgrade |
| Maximum substrate size | 630mm×730mm (effective exposure size 623mm×730mm) |
| Minimum substrate size | 250mm×250mm (single machine), 400mm×400mm (automatic line) |
| Substrate thickness | 0.1mm~5mm (single machine), 0.1mm~3.5mm (wired) |
| Process analysis (bridge/window opening) | 50µm/75µm |
| Line width uniformity | ±10% |
| Depth of field | ±300μm |
| DMD splicing | ≤3μm |
| Outer layer alignment accuracy | ±12μm |
| Energy uniformity | ≥95% |
| Undercut | When the ink thickness is 25μm, the undercut value is less than 15μm |
| Ink color | varisity |
| Exposure time (623mm×680mm & four-point orientation, excluding upper and lower boards) | 10 seconds/face @500mj/cm² |
| Production efficiency (623mm×680mm & four-point position) | 6 sides/minute @500mj/cm² |
| Number of stand-alone countertops | upper and lower interactive double countertops |
| Weight of stand-alone equipment | 5000kg |
| Stand-alone dimensions | 3150mm×1700mm×1950mm |
| Automatic wire size | 6380mm×3460mm×2455mm (excluding plate receiver machine) |
| Working height (transmission height) | 1030±20mm |
.svg)
