Product advantages
using the high-speed laser drilling
control system of acousto-optic devices
Product advantages
rapid zoom within 100ns level can change
laser spot energy density and size
Product advantages
real-time detection
Product advantages
high-precision
| Application field | circuit board |
| Processing material | FPC copper plate |
| Plate thickness range | ≤1.0mm |
| Drilling speed | ≥300 holes/s (Material,12μmCu/25μmPI/12μmCu,75μm BVH/TVH) |
| Drilling accuracy | X&Y axis ≤±20μm, pore CPK≥1.33 |
| Effective processing size | 550mm×650mm |
| Fixed mode | vacuum adsorption platform |
| Drilling aperture range | ≥25μm, PI or copper burr ≤3μm |
| True roundness | TOP≥90%, BOT≥90% (Material,12μmCu/25μmPI/12μmCu,75μm BVH/TVH) |
| Aperture tolerance | ≤±5% |
| Taper (upper and lower aperture ratio) | Taper (hole bottom/hole top)≥80% (Material-12μmCu/25μmPI/12μmCu.75μm BVH/TVH) |
| Drive system | vibrating mirror platform linkage |
| Positioning accuracy | ±2μm |
| Repeat positioning accuracy | ±1μm |
| Maximum acceleration of the machine | 1.5G |
| Precision positioning | 5 million pixels 1.6mmx1.2mm |
| Rough positioning | 5 million pixels 9.6mmx7.2mm |
| Surveillance camera | 130W, 30mmx30mm |
| Focus spot size | ≤25μm |
| Equipment size | length× width × height = 1500mm×600mm×1700mm (excluding tricolor lamps) |
| Equipment weight | 2100kg |
| Equipment power supply | AC 3x380V/25A |
| Equipment gas source | 0.4-0.6MPa |
| Base material | marble base |
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