DPM-06 Measurement and Exposure Integrated Equipment Blockbuster Release "Changing Human Life with Micro-nano Processing"

MIKOPTIK For advanced packaging applications, DPM-06 measurement and exposure integrated equipment is launched, using innovative double-table architecture, self-developed real-time graphic compensation algorithm, and high-precision position measurement system to provide an overall solution for the Fan out packaging process to solve the die shift problem.

Adaptive Patterning® technical workflow

The exposure graphics of each substrate are the unique exposure graphics generated based on the measurement data and do not require a solid mask.

01. The substrate carrying die

02. Independent optical AOI detection equipment

03. Die position measurement information

04. Real-time generation of exposure graphics

05. Laser direct writing LDI equipment exposure

06. Exposure completed substrate

-From DecaTechnology

Yuanzhuo Weina's self-developed integrated measurement and exposure equipment workflow

The exposure graphics of each substrate are the unique exposure graphics generated based on the measurement data and do not require a solid mask.

01. The substrate carrying die

02. Laser direct writing LDI equipment has its own measurement device

03. Die position measurement information

04. Real-time generation of exposure graphics

05. Laser direct writing LDI equipment exposure

06. Exposure completed substrate

Compared with Adaptive Patterning® technology, Yuanzhuo Weina's DPM-06 integrated measurement and exposure equipment has completely independent intellectual property rights and has the following advantages:

1. The integrated design of measurement and exposure uses the device's own alignment sensor for die position measurement without the need for separate AOI optical measurement equipment, which reduces the overall cost.

2.  The unique double table structure, measurement and exposure are carried out alternately, and exposure is carried out at the same time as measurement to increase the yield.

3.  The self-developed graphic compensation software algorithm can process the location information measured by die at high speed and generate graphic compensation in real time.